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气溶胶喷印在精细电子印刷中的应用
引用本文:Christian Goth,Sonja Putzo,Joerg Franke,王晓芳.气溶胶喷印在精细电子印刷中的应用[J].中国印刷与包装研究,2013,5(2):76-80.
作者姓名:Christian Goth  Sonja Putzo  Joerg Franke  王晓芳
摘    要:三维模塑互连器件(3D—MID)技术是指在注塑成型的塑料壳体的表面上,制作具有电气功能的三维立体电路及互联器件的技术。激光直接成型(LDS)技术是制造3D—MID的一种新型、经济的工艺技术。采用LDS技术制造3D—MID的工艺流程主要分为三步:①注塑成型,采用可激光活化的改性塑料为原料,用普通的注塑成型技术注射出塑料本体;②激光活化,采用聚焦激光束照射到塑料表面需要制作导电图形的部位,活化、粗糙图形部位的表面;③金属镀覆,用化学方法将导电金属沉积到被激光活化的图形表面,从而实现在三维塑料上制造导电图形,形成互连器件。

关 键 词:气溶胶  成型技术  改性塑料  注塑成型  应用  印刷  电子  工艺流程

Aerosol Jet Printing on Rapid Prototyping Materials for Fine Pitch Electronic Applications
Abstract:Printing technologies allow the production of fine pitch electronic applications supporting further miniaturization of mechatronic systems. Aerosol Jet is an innovative noncontact and masldess printing process for fine structures below 50 μm with the possibility to process a wide variety of inks, including nanoparticle inks on different substrate materials. The large viscosity range of processible inks (0.7 - 2500cP), a flexible stand - off between substrate and nozzle ( 1 to 5mm) as well as the tightly focused aerosol stream for a variable line width leads to advantages compared to other printing methods like ink -jet. The concern of this research work is to qualify the Aerosol Jet technique to manufacture prototypes for MID (Molded Interconnect Devices). Therefore, three different inks are examined for their suitability concerning adhesiveness, conductivi- ty and wetting characteristics on four different substrates. The research activities focus on stereo lithography materials (resins) with high heat resistance suitable for soldering processes. The materials are analyzed with reference to thermoplastic substrates. The experiments are performed on untreated and plasma activated substrates. Besides the ink/substrate combination, optimizing the process parameters (aerosol stream, process velocity, and number of printed layers) have shown crucial effect.
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