A Practical Implementation of Silicon Microchannel Coolers for High Power Chips |
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Authors: | Colgan EG Furman B Gaynes M Graham WS LaBianca NC Magerlein JH Polastre RJ Rothwell MB Bezama RJ Choudhary R Marston KC Toy H Wakil J Zitz JA Schmidt RR |
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Affiliation: | IBM T. J. Watson Res. Center, Yorktown Heights, NY; |
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Abstract: | This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or more |
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