| 大板面高密度印制板的双面贴装技术 |
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| 引用本文： | 李元山.大板面高密度印制板的双面贴装技术[J].电子工艺技术,1999,20(6):239-241. |
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| 作者姓名： | 李元山 |
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| 作者单位： | 国防科技大学计算机研究所!湖南长沙410073 |
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| 摘 要： | 叙述了大板面双面混装工艺中对ＰＣＢ的设计、制作以及元器件布局等方面的要求，分析了该工艺的特点和难点，并对可能造成故障的原因进行了较为详细的探讨，提出了相应的解决办法。
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| 关 键 词： | 大板面 高密度 双面组装 PCB 电子组装 |
Double-Sided Assembly Technology for Printed Circuit Board of Large Panel and High Density |
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| LI Yuan-shan.Double-Sided Assembly Technology for Printed Circuit Board of Large Panel and High Density[J].Electronics Process Technology,1999,20(6):239-241. |
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| Authors: | LI Yuan-shan |
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| Abstract: | Describe the requirements of PCB design,manufacture and distribution of components in mixed assembly technology on large panel,analyze the features and difficulties,inquire into the edtailed reasons of probably causing trouble and give the corresponding resolving methods. |
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| Keywords: | Large panel High density Double-sided assembly |
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