| 智能硅基多维复用与处理芯片 |
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| 引用本文： | 王健,郑爽,曹晓平. 智能硅基多维复用与处理芯片[J]. 中兴通讯技术, 2020, 0(2): 51-63 |
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| 作者姓名： | 王健 郑爽 曹晓平 |
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| 作者单位： | 1.华中科技大学武汉光电国家研究中心 |
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| 基金项目： | 国家重点研发计划(2019YFB2203604、2018YFB2200204);国家自然科学基金(11774116);湖北省杰出青年基金(2018CFA048);广东省重点领域研发计划(2018B030325002);长江学者奖励计划青年学者;国家万人计划青年拔尖人才;华中科技大学学术前沿青年团队(2016QYTD05)。 |
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| 摘 要： | 全面综述了硅基光子单一维度和多个维度的复用与处理,梳理了智能硅基光子集成器件的发展过程。智能硅基多维复用与处理芯片能充分开发和利用光子多维度资源,并能结合硅基光子集成芯片的优势,有望为解决光通信新容量危机和新能耗危机提供核心光电子支撑技术和芯片,从而为实现光通信可持续发展和其他相关应用提供潜在芯片级集成化解决方案。
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| 关 键 词： | 硅基光子学 光通信 光子集成芯片 多维复用与处理 人工智能 神经网络 |
Intelligent Silicon-Based Multi-Dimensional Multiplexing and Processing Chips |
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| WANG Jian,ZHENG Shuang,CAO Xiaoping. Intelligent Silicon-Based Multi-Dimensional Multiplexing and Processing Chips[J]. ZTE Communications, 2020, 0(2): 51-63 |
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| Authors: | WANG Jian ZHENG Shuang CAO Xiaoping |
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| Affiliation: | (Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,China) |
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| Abstract: | In this paper,silicon-based photonic single-and multi-dimensional multiplexing and processing are comprehensively reviewed.The development of intelligent silicon-based photonic integrated devices is also reviewed.Intelligent silicon-based multi-dimensional multiplexing and processing chips can fully develop and make use of multiple physical dimension resources of photons and take the distinct advantages of silicon-based photonic integrated circuits.It is expected to provide the key optoelectronic supporting techniques and chips for addressing the capacity crunch and energy consumption crisis of optical communications.Consequently,intelligent silicon-based multi-dimensional multiplexing and processing chips provide the potential chip-level integrated solutions for realizing the sustainable development of optical communications and other related applications. |
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| Keywords: | silicon photonics optical communications photonic integrated circuits multi-dimensional multiplexing and processing artificial intelligence neural network |
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