| 填充Co的CoCrCuFeNi高熵合金扩散焊接头的组织和扩散机制 |
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| 引用本文： | 李娟,罗少敏,赵宏龙,周念,秦庆东.填充Co的CoCrCuFeNi高熵合金扩散焊接头的组织和扩散机制[J].稀有金属材料与工程,2023,52(4):1176-1183. |
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| 作者姓名： | 李娟 罗少敏 赵宏龙 周念 秦庆东 |
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| 作者单位： | 贵州理工学院 贵州省轻金属材料制备技术重点实验室，贵州 贵阳 550003,贵州理工学院 贵州省轻金属材料制备技术重点实验室，贵州 贵阳 550003,贵州理工学院 贵州省轻金属材料制备技术重点实验室，贵州 贵阳 550003,贵州理工学院 材料与能源工程学院，贵州 贵阳 550003,贵州理工学院 贵州省轻金属材料制备技术重点实验室，贵州 贵阳 550003;贵州理工学院 贵州省特种功能材料2011协同创新中心，贵州 贵阳 550003 |
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| 基金项目： | 国家自然科学基金[51964011]；贵州省科技计划项目[黔科合基础-ZK[2022]一般175]；贵州省教育厅青年人才成长项目[黔教合KY[2022]342]；贵州理工学院学术新苗培养及创新探索项目[GZLGXM-13]；贵州理工学院高层次人才项目[XJGC20190916] |
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| 摘 要： | 在850,950,1050和1100℃下，填充Co中间层对CoCrCuFeNi高熵合金（HEA）进行了扩散焊接，并对接头微观组织和扩散机制进行了分析。结果表明，在各温度下接头均形成了牢固的结合，接头无金属间化合物生成，高熵合金侧界面周围残留部分柯肯达尔孔。对Cr、Fe、Cu和Ni在Co填充层中的扩散系数进行了计算，排序如下：Cu>Cr>Fe>Ni。所有元素的扩散速度均在相同水平，CoCrCuFeNi高熵合金和Co填充层之间的扩散是在空位机制和晶界扩散机制的共同作用下发生的。
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| 关 键 词： | 高熵合金 扩散焊 显微组织 扩散系数 扩散机制 |
| 收稿时间： | 2022/10/9 0:00:00 |
| 修稿时间： | 2023/4/4 0:00:00 |
Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler |
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| Li Juan,Luo Shaomin,Zhao Honglong,Zhou Nian and Qin Qingdong.Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler[J].Rare Metal Materials and Engineering,2023,52(4):1176-1183. |
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| Authors: | Li Juan Luo Shaomin Zhao Honglong Zhou Nian and Qin Qingdong |
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| Affiliation: | Key Laboratory of Light Metal Materials Processing Technology of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003 China,Key Laboratory of Light Metal Materials Processing Technology of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003 China,Key Laboratory of Light Metal Materials Processing Technology of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003 China,Department of Materials & Energy Engineering, Guizhou Institute of Technology, Guiyang 550003, China,Key Laboratory of Light Metal Materials Processing Technology of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003 China;Special Functional Materials Collaborative Innovation Center of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003, China |
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| Abstract: | A CoCrCuFeNi high-entropy alloy (HEA) was diffusion welded using a Co filler at 850, 950, 1050, and 1100 °C, and the microstructure and diffusion mechanism of the joints were examined. Results show that firm connections are achieved at each temperature, no intermetallic compound forms in the joints, and some Kirkendall voids are remained on the HEA side around the interface. The diffusion coefficients of Cr, Fe, Ni, and Cu in the Co filler at 850 and 950 °C are calculated, ranked as follows: Cu>Cr>Fe>Ni. The diffusion rates of all elements are at the same level. The diffusion between the CoCrCuFeNi HEA and Co filler occurs under the combined action of the vacancy and grain boundary diffusion mechanisms. |
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| Keywords: | high-entropy alloy diffusion welding microstructure diffusion coefficient diffusion mechanism |
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