| 形变原位铜基复合材料的研究进展 |
| |
| 引用本文： | 张俊超,刘平,田保红,任凤章.形变原位铜基复合材料的研究进展[J].材料导报,2006,20(8):80-83. |
| |
| 作者姓名： | 张俊超 刘平 田保红 任凤章 |
| |
| 作者单位： | 河南科技大学材料科学与工程学院,洛阳,471003 |
| |
| 基金项目： | 国家自然科学基金，河南省杰出青年科学基金 |
| |
| 摘 要： | 综述了形变原位铜基复合材料的制备方法、组织演变及综合性能特点,介绍了该类材料的强化和导电机理.分析指出:形变原位铜基复合材料兼顾了高强度和高导电性,已成为高强高导铜基导电材料研发领域的热点之一,降低生产成本、研究产业化制备工艺、深入完善基础理论是该类材料的发展趋势.最后探讨了该类材料的应用前景.
|
| 关 键 词： | 原位铜基复合材料 形变 强化机理 导电机理 |
Review on Deformation-processed Cu-based In-situ Composite |
| |
| ZHANG Junchao,LIU Ping,TIAN Baohong,REN Fengzhang.Review on Deformation-processed Cu-based In-situ Composite[J].Materials Review,2006,20(8):80-83. |
| |
| Authors: | ZHANG Junchao LIU Ping TIAN Baohong REN Fengzhang |
| |
| Affiliation: | School of Material Science and Engineering, Henan University of Science and Technology, Luoyang 471003 |
| |
| Abstract: | This paper reviews the fabrication processes of deformation processed Cu-based in-situ composites as well as microstructure evolution and combined properties, introduces the strengthening and electric conduction mechanisms of this materials. It points out that Cu-based in-situ composites possessing high strength and conductivity have become one of hotspots in the field of research on high strength and conductivity Cu-based composites, and lowering product cost, researching fabrication technique of industrialization and perfecting basis theory are development tendency of this materials. It finally presents the potential application of this materials. |
| |
| Keywords: | Cu-based in-situ composite deformation strengthening mechanism electric conduction mechanism |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
