| HBP-SiO2对氰酸酯树脂固化动力学的影响 |
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| 引用本文： | 张梦萌,颜红侠,管兴华,王倩倩.HBP-SiO2对氰酸酯树脂固化动力学的影响[J].粘接,2012(3):60-63. |
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| 作者姓名： | 张梦萌 颜红侠 管兴华 王倩倩 |
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| 作者单位： | 西北工业大学理学院应用化学系,陕西西安,710129 |
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| 基金项目： | 航空科学基金，西北工业大学基础研究基金 |
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| 摘 要： | 为了提高nano-SiO2在树脂基体中的分散性,采用一种超支化聚硅氧烷修饰的纳米二氧化硅(HBP-SiO2)改性氰酸酯(CE)树脂。利用非等温差示扫描量热法(DSC)研究了HBP-SiO2/CE电子封装材料的固化动力学,求得其固化工艺参数和固化动力学参数分别为:凝胶温度150.17℃,固化温度197.81℃,后处理温度258.97℃;表观活化能11.22kJ/mol,反应级数0.75,频率因子18342.84s-1。研究表明,HBP-SiO2的加入可以降低CE的活化能,使其固化反应可以在较低温度下进行。
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| 关 键 词： | 超支化二氧化硅 氰酸酯树脂(CE) 固化反应动力学 |
Influences of HBP-SiO2 on curing kinetics of cyanate ester resins |
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| ZHANG Meng-meng
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YAN Hong-xia
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GUAN Xing-hua
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WANG Qian-qian.Influences of HBP-SiO2 on curing kinetics of cyanate ester resins[J].Adhesion in China,2012(3):60-63. |
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| Authors: | ZHANG Meng-meng YAN Hong-xia GUAN Xing-hua WANG Qian-qian |
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| Affiliation: | (Department of Applied Chemistry,School of Science,Northwestern Polytechnical University Xi＇ an,Shanxi 710129,China) |
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| Abstract: | In order to improve the dispersity of nano-SiO2 in the resins matrix, the nano-SiO2 grafted with hyperbranched polysiloxane （HBP-SiO2） was used to modify the cyanate ester （CE） resins.A kinetic analysis of the HBP- SiO2/CE system as the electrical packaging materials was carried out via differential scanning calorimetry （DSC） .The curing process parameters and curing kinetics parameters were obtained as follows：gelling temperature 150.17℃,cuing temperature 197.81 ℃,post-treating temperature 258.97 ℃;activation energy 11.22kJ/mol,reaction order 0.75,frequency factor 18 342.84s-1,respectively.The results indicated that the addition of HBP-SiO2 can lower the activation energy of the PPO/CE system and the curing reaction can occur at a relative low temperature. |
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| Keywords: | HBP-SiO2 cyanate ester curing kinetics |
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