| 高性能双组分室温固化环氧胶的研制 |
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| 引用本文： | 范福庭,沈晓成.高性能双组分室温固化环氧胶的研制[J].粘接,2012(6):61-64. |
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| 作者姓名： | 范福庭 沈晓成 |
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| 作者单位： | 上海市合成树脂研究所,上海,200235 |
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| 摘 要： | 以环氧E-51、增韧剂R-1000、偶联剂KH-560、聚酰胺651、酚醛胺和促进剂DMP-30为原料,制备了一种高粘接性能、双组分室温固化环氧胶。研究了DMP-30的用量对环氧胶适用期的影响;R-1000、KH-560的用量和A、B组分配比对环氧胶粘接性能的影响。结果表明,m(聚酰胺+酚醛胺/mDMP-30=100/12时,环氧胶的适用期为40～45min;mE-51/mR-1000=100/16、mE-51/mKH-560=100/2,mA/mB=3.0/1.0时,环氧胶的粘接性能最佳。
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| 关 键 词： | 双组分 环氧胶 室温固化 高粘接性能 |
On preparation of room-temperature curable two-component epoxy adhesive with high bonding properties |
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| FAN Fu-ting
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SHEN Xiao-cheng.On preparation of room-temperature curable two-component epoxy adhesive with high bonding properties[J].Adhesion in China,2012(6):61-64. |
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| Authors: | FAN Fu-ting SHEN Xiao-cheng |
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| Affiliation: | (Shanghai Research Institute of Synthetic Resins,Shanghai 200235,China) |
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| Abstract: | Using epoxy resin （E-51）,toughening agent （R- 1000）,coupling agent （KH-560）,polyamide 651 ,phenolic amine and accelerant （DMP-30） as the raw materials,a two-component room temperature curable epoxy adhesive with high bonding properties was prepared.The effects of DMP-30 amount on the pot life of epoxy adhesive and of the amounts of R- 1000 and KH-560 and weight ratio of A and B component on the bonding properties of epoxy adhesive were studied.The results showed that the pot life of epoxy adhesive is 40-45 min when m （polyamide-phenolic amine）/m （DMP-30） is 100/12;the epoxy adhesive bonding properties and optimal when m （E-51） /m （R-1000） ,m （E-51） /E （KH-560） and m （A） /m （B） are 100/16,100/2 and 3.0/1.0,respectively. |
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| Keywords: | two-component epoxy adhesive room temperature curable high bonding property |
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