| 印制板ConductronDP直接电镀新工艺研究 |
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| 引用本文： | 杨维生 毛晓丽. 印制板ConductronDP直接电镀新工艺研究[J]. 化工时刊, 1999, 13(5): 26-31 |
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| 作者姓名： | 杨维生 毛晓丽 |
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| 作者单位： | [1]南京第十四研究所 [2]南京无线电工业学校 |
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| 摘 要： | 介绍印制线路板生产的Ｃｏｎｄｃｕｔｒｏｎ直接电镀工艺，对该体系所采用的加速剂Ｇ２和ＥＸ进行了对比试验，并对药液浓度，试验溶液温度和浸没时间进行了总结。
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| 关 键 词： | 直接电镀 印制线路板 废水处理 电镀 |
Study on Conductron DP Direct Plating of Printed Circuit Board |
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| Yang Weisheng Mao Xiaoli. Study on Conductron DP Direct Plating of Printed Circuit Board[J]. Chemical Industry Times, 1999, 13(5): 26-31 |
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| Authors: | Yang Weisheng Mao Xiaoli |
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| Abstract: | Conductron direct plating to process printed circuit boards was introduced. Accelerator G2 and Accelerator EX of Lea Ronal Conduction system were evaluated. Plating chemicals concentration, bath temperature and immersion time were also proposed. |
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| Keywords: | Direct plating Printed circuit board Accelerator Waste water treatment |
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