现代微电子行业的新型湿法清洗工艺

随着半导体技术的不断发展，集成电路的线宽在不断减小，对硅抛光片表面质量的要求也越来越高，为使芯片上的器件功能正常．避免硅片制造中的沾污是绝对必要的。传统的RCA清洗方法已不能满足其需求。因此，必须发展新的清洗方法。本文对传统的RCA清洗方法进行了简单的介绍，在此基础上，介绍新发展的HF／O3清洗法，从而对450mm硅片清洗方法的未来发展方向进行了简单论述。

New Type of Wet Cleaning Process in Modern Microelectronics Industry

With the continuous development of semiconductor technology and the integrated circuits continuous decreasing in the line width, the surface requirement of the quality of silicon wafer has become more sophisticated. To avoid contaminations stained on the silicon wafer during the manufacturing is absolutely necessary. The traditional RCA cleaning method can not meet the need. In this paper, the traditional RCA cleaning method is simply introduced. At the bases, the introduction of the new developments HF/O3 cleaning method and the future development of 450mm silicon wafer cleaning method are expatiated.