Modeling growth rate of HfO2 thin films grown by metal-organic molecular beam epitaxy

HfO₂ dielectric layers were grown on the p-type Si (100) substrate by metal-organic molecular beam epitaxy (MOMBE). Hafnium-tetra-butoxide, Hf(O·t-C₄H₉)₄ was used as a Hf precursor and Argon gas was used as a carrier gas. The thickness of the HfO₂ film and intermediate SiO₂ layer were measured by scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). The properties of the HfO₂ layers were evaluated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), high frequency (HF) capacitance-voltage (C-V) measurement, and current-voltage (I-V) measurement. C-V and I-V measurements have shown that HfO₂ layer grown by MOMBE has a high dielectric constant (k) of 20-22 and a low-level of leakage current density. The growth rate is affected by various process variables such as substrate temperature, bubbler temperature, Ar and O₂ gas flows and growth time. Since the ratio of O₂ and Ar gas flows are closely correlated, the effect of variations in O₂/Ar flow ratio on growth rate is also investigated using statistical modeling methodology.