COB塑料基板和玻璃封装的LED灯具双通道散热分析

提出了一种新的LED灯具封装方式,使用高导热玻璃壳和惰性气体替代传统的环氧树脂进行封装,使用塑料散热器代替传统铝基板,以达到双通道散热的效果。采用ANSYS有限元热分析软件,优化惰性气体层厚度,并通过改变LED个数和单灯功率与传统的陶瓷基板COB封装方式进行热仿真对比分析。研究表明,惰性气体层厚度为1.5 mm时散热效果较好,双通道散热灯具的热阻远小于单通道散热灯具热阻。由于玻璃与传统的环氧树脂相比,透光性高、不易老化、抗紫外线效果好,在大功率、密集型封装和紫外LED灯具大发展的市场环境下,这种新的封装方式应用前景广阔。

Dual Channel Heat-dissipation Analysis of LED Luminaire with COB Plastic Substrate and Glass Encapsulation

A new encapsulating mode for LED luminaire is introduced. Dual channel heat-dissipation effect is obtained by using high thermal conductive glass shell and inert gas to encapsulate instead of traditional epoxy resin and using plastic heating-radiator instead of traditional aluminum substrate. The thickness of inert gas layer is opti-mized with ANSYS finite element thermal analysis software. Thermal simulation results are compared and analyzed through changing the number of LED, the power of a single LED and traditional ceramic substrate chip on board （COB） encapsulation mode. Research results show that heat-dissipation effect is better when the thickness of inert gas layer is 1.5 mm and the thermal resistance of dual channel heat-dissipation luminaire is far less than that of sin-gle channel. Comparing with traditional epoxy resin, plastic has the characteristics of high transmissivity, anti-aging and good anti-ultraviolet effect. The new encapsulation mode has widely application prospect in the market enviro-ment of widely development of UV LED luminaire with high power and intensive encapsulation.