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Thermal Cycling of Temperature and Strain Rate Dependent Solder Joints |
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| Authors: | Skipor AF Harren SV |
| Affiliation: | (1) Corporate Manufacturing Research Center, Motorola, 1301 East Algonquin Road, Rm 1014, Schaumburg, IL 60196, U.S.A.;(2) Department of Civil and Materials Engineering, The University of Illinois at Chicago, IL, 60607, U.S.A. |
| Abstract: | |
| Keywords: | fatigue solder viscoplasticity |
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