| 新型导电胶粘剂的研制及其固化动力学研究 |
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| 引用本文： | 虞鑫海,陈洪江,刘万章.新型导电胶粘剂的研制及其固化动力学研究[J].粘接,2010,31(7):36-39. |
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| 作者姓名： | 虞鑫海 陈洪江 刘万章 |
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| 作者单位： | 1. 东华大学应用化学系,上海,201620
2. 浙江金鹏化工股份有限公司,浙江台州,318050 |
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| 摘 要： | 以环氧树脂、增韧剂、活性稀释剂、潜伏性固化剂、导电粒子为主原料，制得了综合性能良好的单组分导电胶粘剂。利用差示扫描量热法（DSC）对该导电胶进行了固化动力学研究，获得了多种动力学参数。
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| 关 键 词： | 环氧树脂 导电胶 固化动力学 |
Preparation of novel electrically conductive adhesive and study of curing reaction kinetics thereof |
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| YU Xin-hai,CHEN Hong-jiang,Liu Wan-zhang.Preparation of novel electrically conductive adhesive and study of curing reaction kinetics thereof[J].Adhesion in China,2010,31(7):36-39. |
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| Authors: | YU Xin-hai CHEN Hong-jiang Liu Wan-zhang |
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| Affiliation: | 1. Department of Applied Chemistry, Donghua University, Shanghai 201620, China; 2. Zhejiang Golden Roc Chenical Co., Ltd., Taizhou, Zhejiang 318050, China) |
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| Abstract: | Based on the main raw materials including epoxy resin, toughener, reactive diluent, latent curing agent and electrically conductive particles, the novel electrically conductive adhesive with excellent comprehensive properties was prepared. Moreover, the curing reaction kinetics was further studied and the parameters were also discovered by the differential scanning calorimetry（DSC） method and Crane, Kissinger,Arrhenius equations. |
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| Keywords: | epoxy resin electrically conductive adhesive curing reaction kinetics |
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