A performance and manufacturability evaluation of bump chip carrier packages

Bump chip carrier (BCC) registered trademark of Fujitsu Ltd.] is an attractive solution to the demand of high packaging density of low input/output (I/O)-count packages. In this paper, an extensive finite element thermomechanical analysis has been conducted to evaluate the reliability of BCC packages, both with and without heat slugs, during thermal cycling. The effect of a variety of parameters on package reliability has been evaluated, including board thickness, package size mold material, solder paste thickness, and terminal height. The solder reliability of corner leads versus inner leads, as well as square leads versus rectangular leads has also been investigated. During manufacturing, molded panels for BCC packages undergo significant warpage. Two types of mold designs are compared through three-dimensional finite element analysis. A variety of mold compound materials have been evaluated. The most effective ways to reduce manufacturing-induced warpage have been suggested.