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FPC用丙烯酸酯耐高温保护膜的制备和性能研究
引用本文:肖建伟,刘大娟,严辉,李桢林,范和平. FPC用丙烯酸酯耐高温保护膜的制备和性能研究[J]. 中国胶粘剂, 2013, 0(3): 26-30
作者姓名:肖建伟  刘大娟  严辉  李桢林  范和平
作者单位:江汉大学;华烁科技股份有限公司
摘    要:以丙烯酸丁酯(BA)和丙烯酸异辛酯(2-EHA)为软单体、醋酸乙烯酯(VAc)为硬单体、丙烯酸(AA)和甲基丙烯酸缩水甘油酯(GMA)为交联单体、三苯基膦为促进剂和偶联剂A/外交联剂B为复合交联剂,采用改进聚合工艺制得溶剂型丙烯酸酯PSA(压敏胶)。研究结果表明:当m(偶联剂A)∶m(外交联剂B)=2∶1、w(偶联剂A/外交联剂B)=0.40%、m(BA)∶m(2-EHA)∶m(VAc)=8∶2∶2、w(三苯基膦)=0.5%和m(GMA)∶m(AA)=2∶1时,该PSA的综合性能相对较好,其耐高温性能(≤180℃)优异、90°耐高温剥离强度适中(2.0 N/25 mm)且不随放置时间延长而增长,并且胶膜经高温处理后从铜箔上剥离时无残胶痕迹,能够满足FPC(柔性印制线路板)用耐高温保护膜的使用要求。

关 键 词:柔性印制线路板  柔性覆铜板  压敏胶  保护膜  交联  耐高温性能

Study on preparation and properties of acrylate protective film with high-temperature resistance for FPC
Xiao Jianwei,Liu Dajuan,Yan Hui,Li Zhenlin,Fan Heping. Study on preparation and properties of acrylate protective film with high-temperature resistance for FPC[J]. China Adhesives, 2013, 0(3): 26-30
Authors:Xiao Jianwei  Liu Dajuan  Yan Hui  Li Zhenlin  Fan Heping
Affiliation:1.Jianghan University,Wuhan 430056,China;2.HAISO Technology Co.,Ltd.,Wuhan 430074,China)
Abstract:With butyl acrylate(BA) and 2-ethylhexyl acrylate(2-EHA) as soft monomers,vinyl acetate(VAc) as hard monomer,acrylic acid(AA) and glycidyl methacrylate(GMA) as crosslink monomers,triphenylphosphine as accelerant,and coupler A/exterior cross linker B as composite cross linker,a solvent type acrylate PSA(pressure sensitive adhesive) was prepared by improved polymerization process.The research results showed that the PSA had relatively better combination property and could meet application requirement of protective film with high-temperature resistance for FPC(flexible printed circuit board) because its high-temperature resistance(not more than 180 ℃) was excellent,the moderate 90° peeling strength(2.0 N/25 mm) with high-temperature resistance was not increased with increasing placed time,and copper foil without trace of remnant PSA film,which was peeled from copper foil surface after heat treatment,was obtained when mass ratios of m(BA)∶m(2-EHA)∶m(VAc),m(coupler A)∶m(exterior cross linker B) and m(GMA)∶m(AA) were 8∶2∶2,2∶1 and 2∶1 respectively,mass fractions of coupler A/exterior cross linker B and triphenylphosphine were 0.40% and 0.5% respectively.
Keywords:flexible printed circuit board(FPC)  flexible copper clad laminate(FCCL)  pressure sensitive adhesive(PSA)  protective film  crosslink  high-temperature resistance
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