首页 | 本学科首页   官方微博 | 高级检索  
     


Mechanical and damage analysis along a flat-rolled wire cold forming schedule
Authors:Thomas Massé  Yvan Chastel  Pierre Montmitonnet  Christian Bobadilla  Nicolas Persem  Sylvain Foissey
Affiliation:(1) Mines ParisTech, CEMEF - Centre for Material Forming, CNRS UMR 7635, BP 207, 1 Rue C. Daunesse, 06904 Sophia-Antipolis Cedex, France;(2) ArcelorMittal Gandrange, Research and development - Long Carbon Bars & Wires, BP 3, 57360 Amn?ville, France;(3) ArcelorMittal Wire Solutions, 25 Avenue de Lyon, 01000 Bourg-en-Bresse, France;(4) DER/SESI/LE2S, CEA Cadarache, B?t 212 - P27, 13108 St Paul-Lez-Durance Cedex, France
Abstract:Numerical simulation is used to study patented high-C steel flat-rolled wire cold forming processes. An elasto-plastic power law, identified from mechanical tests, is used into Forge2005? finite element (FEM) package in order to describe the material behaviour during wire drawing followed by cold rolling. A through-process approach has been favoured, transferring residual wire-drawing stresses and strain into the flat-rolling preform. This mechanical analysis, associated with a triaxiality study, points to dangerous areas where fracture may initiate due to high tensile stresses. Lema?tre’s isotropic damage criterion, including crack closure effect, a -1/3 cut-off value of stress triaxiality, and tension/compression damage asymmetry, has been used and has confirmed the previous analysis. A number of non-coalesced voids nucleated on inclusions have been observed in the Scanning Electron Microscopy (SEM), especially in high-deformation zones (“blacksmith’s cross”). Their evolution has been simulated in the FEM model using spherical numerical markers, which deform into oblate or prolate ellipsoids. The deformation-induced morphological evolution of voids observed in the SEM compares well with the geometrical evolution of the markers, which suggests that the morphologies observed do not result from micro-crack propagation, but from material transport of the nucleated voids.
Keywords:
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号