| 无铅焊料的知识产权状况分析 |
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| 引用本文： | 刘一波,吴懿平,吴丰顺,邬博义,张金松.无铅焊料的知识产权状况分析[J].电子元件与材料,2004,23(4):39-41. |
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| 作者姓名： | 刘一波 吴懿平 吴丰顺 邬博义 张金松 |
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| 作者单位： | 华中科技大学材料科学与工程学院,湖北,武汉,430074;华中科技大学材料科学与工程学院,湖北,武汉,430074;华中科技大学材料科学与工程学院,湖北,武汉,430074;华中科技大学材料科学与工程学院,湖北,武汉,430074;华中科技大学材料科学与工程学院,湖北,武汉,430074 |
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| 摘 要： | 简要介绍了世界电子产品无铅化趋势及其相关立法,比较了世界各国及地区的无铅专利发展情况。对比了各国公司或个人在我国申请注册的无铅焊料相关专利,对国内无铅焊料专利权利要求书的完善提出了一些建议。最后指出了我国企业在无铅焊料专利申请上的滞后并提出相关对策。
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| 关 键 词： | 无铅 焊料 专利 知识产权 电子封装 |
| 文章编号： | 1001-2028(2004)04-0039-03 |
The Situation Analysis of Intellectual Property on Lead-free Solder |
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| LIU Yi-bo,WU Yi-ping,WU Feng-shun,WU Bo-yi,ZHANG Jin-song.The Situation Analysis of Intellectual Property on Lead-free Solder[J].Electronic Components & Materials,2004,23(4):39-41. |
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| Authors: | LIU Yi-bo WU Yi-ping WU Feng-shun WU Bo-yi ZHANG Jin-song |
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| Abstract: | After a brief introduction of the lead-free tendency and its relative legislation of the electronin products in worldwide, The patent development on lead-free solder in different countries and regions was compared. The patents have been applied and registered in China by foreign company or some individual was contrasted and some suggestions on domestic patent claims were given. Domestic companies lags on issuing lead-free patent were pointed out and some proposals were offered. |
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| Keywords: | lead-free solder patent intellectual property electronic packaging |
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