Oxide dispersion strengthening of nickel electrodeposits for microsystem applications |
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| Authors: | S. H. Goods R. P. Janek T. E. Buchheit J. R. Michael P. G. Kotula |
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| Affiliation: | (1) the Microsystems and Materials Mechanics Department, Sandia National Laboratories, 94550 Livermore, CA;(2) Owens Technology Inc., 94306 Palo Alto, CA;(3) the Microsystems Materials and Technology Department, Sandia National Laboratories, Albuquerque, NM;(4) the Materials Characterization Department, Sandia National Laboratories, 87185 Albuquerque, NM |
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| Abstract: | Oxide dispersion strengthened nickel (ODS-Ni) electrodeposits were fabricated to net shape using the lithography, electroforming, and molding (LIGA) process in a nickel sulfamate bath containing a suspension of 10 nm diameter Al2O3 particulates. Mechanical properties were compared to baseline specimens fabricated using an identical sulfamate bath chemistry without the particulates. Results revealed that the as-deposited ODS-Ni exhibited significantly higher yield strength and ultimate tensile strength (∼50 pct) than the baseline material. This increase in as-deposited strength was attributed to Orowan strengthening. The ODS-Ni also showed improved retention of room-temperature strength after annealing over a range of temperatures up to 600 °C. Nanoindentation measurements revealed that the properties of the dispersion-strengthened deposit were uniform through its thickness, even in narrow, high aspect ratio structures. Microscopy revealed that this resistance to anneal softening was due to an inhibition of grain growth in the presence of the oxide dispersion. At elevated temperatures, the strength of the ODS-Ni was approximately 3 times greater than that of the baseline material although with a significant reduction in hot ductility. |
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