弹载电子设备相变热沉装置散热性能研究

文中介绍了一种用于弹载电子设备的相变热沉装置的设计方法及试验研究。通过实验对比了电子模块在采用相变热沉装置、铝块和无热沉3种情况下的工作温度曲线，同时对比分析了相变热沉装置在不同热流密度下的工作特性。结果表明，当热源热流密度较小时，相变热沉装置具有明显的减缓热源升温的作用，对比铝块热沉具有明显的散热功效。而随着热流密度的增加，其散热优势逐渐减弱。同时，填料相变温度点的选取和导热增强体的设计，对相变热沉装置的散热性能有很大的影响。

Study on Heat Dissipation Performance of Phase Change Material Heat Sink in Missile Electronics

In this paper, the design method and experimental research of a phase change material (PCM) heat sink used for missile electronics are discussed. The operation temperature curves of electronic modules under 3 conditions of using PCM heat sink, aluminum block and working without heat sink are compared through experiment. The operation performance of PCM heat sink under different heat flux is also compared. Results show that PCM heat sink can apparently slow down the increasing of heat source temperature when heat flux is low, and it is much better than aluminum block as for heat dissipation performance. However, with the heat flux increasing, the heat dissipation performance of PCM heat sink gets worse. Also, it demonstrates that the selection of phase-transition point of PCM and the design of thermal conductivity enhancement structure have great influence on the heat dissipation performance.