| 串扰问题分析及对PCB设计的指导 |
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| 引用本文： | 文开壹.串扰问题分析及对PCB设计的指导[J].电子技术,2014(2):64-67,63. |
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| 作者姓名： | 文开壹 |
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| 作者单位： | UT斯达康通讯有限公司,浙江杭州 |
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| 摘 要： | 文章介绍了引起串扰的原因,串扰的分类及估计,用Mentor Graphics的HyperLynx对不同的PCB叠层结构和线间距、耦合长度等情况下的串扰进行仿真,并总结串扰的特点,最后给出在PCB设计中减少串扰的一些方法。
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| 关 键 词： | PCB设计 容性耦合 感性耦合 后向串扰(近端串扰) 前向串扰(远端串扰) 串扰仿真 |
Analysis of Crosstalk Issue and the Guidance to the PCB Design |
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| Wen Kaiyi.Analysis of Crosstalk Issue and the Guidance to the PCB Design[J].Electronic Technology,2014(2):64-67,63. |
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| Authors: | Wen Kaiyi |
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| Affiliation: | Wen Kaiyi (UT Starcom, Hangzhou, Zhejiang) |
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| Abstract: | This paper presents the reasons, classification and assessment of crosstalk. The HperLynx of Montor Graphics is used to simulate the crosstalk in the cases of different PCB laminated structures and pitches,coupling lengths, and the characteristics of crosstalk are summarized. Finally some methods for reducing crosstalk in PCB design are proposed. |
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| Keywords: | PCB design capacitive coupling inductive coupling crosstalk simulation |
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