A benchmark study of commercially available copper nanoparticle inks for application in organic electronic devices |
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| Affiliation: | 1. Holst Centre – TNO, High Tech Campus 31, 5656AE Eindhoven, The Netherlands;2. CHOSE (Centre for Hybrid and Organic Solar Energy), Department of Electronic Engineering, University of Rome Tor Vergata, Via del Politecnico 1, 00133 Rome, Italy;3. Holst Centre – Solliance, High Tech Campus 21, 5656AE Eindhoven, The Netherlands;4. Novacentrix, 400 Parker Drive, Austin, TX 78728, United States;1. POSTECH Organic Electronics Laboratory, Department of Chemical Engineering, Pohang University of Science and Technology, Pohang, 790-784, Republic of Korea;2. School of Integrative Engineering, Chung-Ang University, 84 Heukseok-Ro, Dongjak-gu, Seoul, 156-756, Republic of Korea;1. Department of Mechanical Engineering, Bradley University, IL, USA;2. Additive Manufacturing and 3D Printing Research Group, EPSRC Centre for Innovative Manufacturing in Additive Manufacturing, Department of Mechanical, Materials and Manufacturing, University of Nottingham, Nottingham, UK;3. Additive Manufacturing and 3D Printing Research Group, EPSRC Centre for Innovative Manufacturing in Additive Manufacturing, Department of Chemical and Environmental Engineering, University of Nottingham, Nottingham, UK;1. Department of Mechanical Design and Production Engineering, Konkuk University, Seoul, 05029, Republic of Korea;2. Department of Organic and Nano System Engineering, Konkuk University, Seoul, 05029, Republic of Korea;3. Department of Polymer Science and Engineering, University of Massachusetts Amherst, 120 Governors Drive, Amherst, MA, 01003, United States;1. Department of Solid State Engineering, University of Chemistry and Technology, 166 28 Prague 6, Czech Republic;2. Faculty of Science, P.J. Safarik University, Park Angelinum 9, 04013 Kosice, Slovakia;3. Faculty of Science, J.E. Purkyne University, 400 96 Usti nad Labem, Czech Republic;4. Department of Physical Chemistry, University of Chemistry and Technology Prague, 166 28 Prague 6, Czech Republic |
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| Abstract: | A set of three commercial copper nanoparticle based inkjet inks has been benchmarked with respect to their potential to form conducting printed structures for future applications in organic electronic devices. Significant differences were observed in terms of jetting properties, spreading behaviour and line formation on a number of relevant substrates. The inks' stabilities against oxidation were investigated, inkjet printed patterns were subjected to photonic flash sintering and their electrical properties characterized. As a result, optimized conditions for printing and post-deposition processing were determined. Photonic flash sintering, which is a roll-to-roll compatible manufacturing process, allowed a significant reduction in sintering time. Flash sintering was performed in the presence of air, thereby excluding the necessity for processing under inert atmosphere. One product was identified which showed satisfactory performances regarding all tested features: stable jet formation, well-defined definition of the printed structures and high electrical conductivity (20% of the value of bulk Cu). The obtained results can be considered as a promising step towards the future application of Cu inks in organic electronic devices. |
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| Keywords: | Photonic flash sintering Copper nanoparticle ink Inkjet printing Organic electronic devices |
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