Micro-scale hole profile measurement using rotating wire probe and acoustic emission contact detection |
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| Affiliation: | 1. Izmir University of Economics, Faculty of Engineering and Computer Science, Balcova, Izmir, Turkey;2. University of Missouri-Columbia, College of Engineering, Columbia, MO, USA;1. Department of Design and Manufacturing Engineering, Universidad de Zaragoza, Zaragoza, Spain;2. Centro Universitario de la Defensa, Zaragoza, Spain;1. Wireless Communication Centre, Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Johor, Malaysia;2. Department of Electrical and Electronic Engineering, University of Mines and Technology, Post Office Box 237, Tarkwa, Ghana;3. Faculty of Engineering, Technology and Built Environment, UCSI University, Kuala Lumpur 56000, Malaysia;4. Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Johor, Malaysia;5. Photonics Research Centre, University of Malaya, 50603 Kuala Lumpur, Malaysia;1. Programa de Pós-Graduação em Engenharia de Telecomunicações, Instituto Federal de Educação, Ciência e Tecnologia do Ceará, Fortaleza, CE, Brazil;2. Programa de Pós-Graduação em Ciências da Computação, Instituto Federal de Educação, Ciência e Tecnologia do Ceará, Fortaleza, CE, Brazil |
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| Abstract: | The development of a new probing method to inspect the inner diameter of micro-scale holes is presented in this paper. This was accomplished by contact detection using acoustic emission with a Ø170 μm rotating wire probe tip. Contact is detected when the rotating probe approaches and impacts the hole’s inner surface. The effective diameter of the rotating probe is calibrated by using a high precision grade 0 Mitutoyo gauge block. The wire rotating probe used was fabricated with micro stainless steel wire and micro tubes. The probe’s effective diameter was compensated for in the measurement of the hole. The probe was used to measure the diameter and the roundness of micro-scale holes. Probes used in previous publications have different geometry than the probe in this paper and are used almost exclusively for external dimensions. Micro-scale holes of less than 1.0 mm in diameter and 10 mm in depth are successfully measured and the 3D profile is created accordingly. Also, the out-of-roundness values of each level spacing, 50 μm apart in height, are calculated. |
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| Keywords: | Micro hole Acoustic emission Hole profile Wire probe |
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