基于图像处理的手机软板缺陷自动检测方法

针对手机软板缺陷细小难以检测和缺陷不修复的特殊性,研究了一种新型的手机软板缺陷检测方法;系统利用COMS(Complementary Metal 0xide Semiconductor)摄像头获取被测手机软板的图像,通过图像预处理、边缘增强、图像分割得到二值图像;在检测针孔和基板夹杂的缺陷后,去除瑕疵干扰,与标准模板图像进行匹配,得到全局缺陷;再根据设计准则,判断局部缺陷;实验研究表明,这种检测方法检测速度快、精度高,兼顾传统的参考比较法和非参考法的优点,对常见短路、断路、缺口和凸起等缺陷都可以进行精确的检测.

Automatic Measurement Method of Mobile Phone FPC Board Defects on the Based of Image Process

For the defects on mobile phoneFPC boardare too tiny to measure by eyes and the defects do not need to be repaired,a new matching measurement method is puts forward.Image is obtained by CMOS(Complementary Metal Oxide Semiconductor)camera,the bi- nary images are acquired after the image pretreatment and the edge enhancement.Once measuring pinhole and flaw,the slight defect disturb- ance is wiped off,it matches with the template to obtain whole defects,part defects are determined by the design judgment criterion.It is showed by experiment that the measurement method is with the characteristics of high speed and high precision,the common defects can be measured accurately.