Thermal characterization of diamond-pressure-bond heat sinking foroptically pumped mid-infrared lasers |
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Authors: | Bewley W.W. Felix C.L. Aifer E.H. Stokes D.W. Vurgaftman I. Olafsen L.J. Meyer J.R. Yang M.J. Lee H. |
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Affiliation: | Naval Res. Lab., Washington, DC; |
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Abstract: | The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II “W” lasers operating in the mid-infrared. Values <2.0 K·cm2/kW were obtained for all temperatures in the range 140-220 K |
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