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Thermal characterization of diamond-pressure-bond heat sinking foroptically pumped mid-infrared lasers
Authors:Bewley   W.W. Felix   C.L. Aifer   E.H. Stokes   D.W. Vurgaftman   I. Olafsen   L.J. Meyer   J.R. Yang   M.J. Lee   H.
Affiliation:Naval Res. Lab., Washington, DC;
Abstract:The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II “W” lasers operating in the mid-infrared. Values <2.0 K·cm2/kW were obtained for all temperatures in the range 140-220 K
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