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Electrospun nanofibers as food freshness and time-temperature indicators: A new approach in food intelligent packaging
Affiliation:1. Department of Food Science and Technology, Faculty of Agriculture, Urmia University, Urmia, Iran;2. Department of Food Hygiene and Quality Control, Faculty of Veterinary Medicine, Urmia University, Urmia, Iran;1. College of Food Science and Technology and MOE Key Laboratory of Environment Correlative Dietology, Huazhong Agricultural University, Wuhan, P. R. China;2. Hubei International Scientific and Technological Cooperation Base of Sustainable Resource and Energy, Hubei Key Lab of Biomass Resource Chemistry and Environmental Biotechnology, School of Resource and Environmental Science, Wuhan University, Wuhan, P. R. China
Abstract:Intelligent packaging with the ability to detect chemical, physical, and/or biological changes in the food is a breakthrough in the food industry. Food freshness indicators (FFI) and time-temperature indicators (TTI) are major groups of intelligent packaging. They can be fabricated as a label, providing a rapid response to food quality or storage temperature changes through color changes. Electrospinning, as an effective and versatile method of preparing continuous nanofibers, has been employed as a promising candidate to manufacture food packaging materials. More recently, electrospun nanofibers have been utilized as a novel platform for the development of FFI/TTI intelligent packaging due to their excellent properties including high molecular orientation, high porosity, high surface area with tailored morphology, and a high level of versatility. This article reviews the morphological/thermal properties, color response activity, and stability of electrospun nanofibers mats as intelligent food packaging (i.e., FFI and TTI-based electrospun nanofibers). The applications of FFI/TTI-based nanofibrous on different food commodities are discussed. Finally, the existing limits and perspectives for the development of electrospinning in the area of intelligent food packaging are discussed.
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