| The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints |
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| 作者姓名： | 闫焉服 闫红星 陈拂晓 张柯柯 朱锦洪 |
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| 作者单位： | Hennan University of Science and Technology，Hennan University of Science and Technology，Hennan University of Science and Technology，Hennan University of Science and Technology，Hennan University of Science and Technology Luoyang 471003，Luoyang 471003，Luoyang 471003，Luoyang 471003，Luoyang 471003 |
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| 摘 要： | Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint.
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The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints |
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| Yan Yanfu,Yan Hongxing,Chen Fuxiao,Zhang Keke,Zhu Jinhong.The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints[J].China Welding,2007,16(1):41-46. |
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| Authors: | Yan Yanfu Yan Hongxing Chen Fuxiao Zhang Keke Zhu Jinhong |
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| Abstract: | Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint. |
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| Keywords: | creep rupture life composite soldered joints particle-enhancement 63Sn37Pb temperature |
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