| 绿色电子制造及绿色电子封装材料 |
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| 引用本文： | 杨艳,尹立孟,冼健威,马鑫,张新平.绿色电子制造及绿色电子封装材料[J].电子工艺技术,2008,29(5). |
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| 作者姓名： | 杨艳 尹立孟 冼健威 马鑫 张新平 |
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| 作者单位： | 1. 华南理工大学,广东,广州,510640
2. 亿铖达工业有限公司,广东,深圳,518101 |
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| 基金项目： | 教育部首批新世纪优秀人才基金 |
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| 摘 要： | 阐述了绿色电子制造(包括电子封装)概念起源、定义以及基本内涵和范畴,并从电子封装用互连材料、被连接材料和封装后清洗过程这三个方面全面阐述了绿色电子封装的主要内容,重点评述了目前绿色电子封装材料(包括无铅钎料、钎剂、焊膏和导电胶等)的研究现状和面临的问题.最后,展望了绿色电子制造及绿色电子封装材料的未来发展趋势.
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| 关 键 词： | 绿色电子制造 电子封装 无铅钎料及钎剂 焊膏 导电胶 清洗剂 |
Green Manufacturing of Electronics and Materials for Green Electronic Packaging |
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| YANG Yan,YIN Li-meng,XIAN Jian-wei,MA Xin,ZHANG Xing-ping.Green Manufacturing of Electronics and Materials for Green Electronic Packaging[J].Electronics Process Technology,2008,29(5). |
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| Authors: | YANG Yan YIN Li-meng XIAN Jian-wei MA Xin ZHANG Xing-ping |
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| Affiliation: | YANG Yan 1,YIN Li-meng1,XIAN Jian-wei1,MA Xin2,ZHANG Xing-ping1(1.South China University of Technology,Guangzhou 510640,China,2.Yik Shing Tat Industry Co.,Ltd.,Shenzhen 518101,China) |
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| Abstract: | Give a brief review of the origin,definition,essential connotation and categories of green manufacturing of electronics(including green electronic packaging),and offer a comprehensive introduction to the main contents of green electronic packaging(GEP)in terms of materials for electronic packaging,substrate/pad and device materials to be packaged,and cleaning agent for post treatment,with the focus on state-of-the-art of the materials for green electronic packaging(such as lead-free solders,flux,solder past... |
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| Keywords: | Green manufacturing of electronics Electronic packaging Lead-free solders and flux Solder paste Electrically conductive adhesive Cleaning agent |
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