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Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys |
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| Authors: | T Takahashi T Yamane Y Minamino T Kimura |
| Affiliation: | (1) Department of Materials Science and Engineering, Niihama National College of Technology, 7-1 Yagumo, 792 Niihama, Japan;(2) Department of Materials Science and Engineering, Faculty of Engineering, Osaka University, 2-1 Yamadaoka, 565 Suita, Osaka, Japan |
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