A novel process with the characteristics of low-temperature bonding and high-temperature resisting for joining Cf/SiC composite to GH3044 alloy |
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| Affiliation: | 1. School of Aviation and Materials, Anhui Technical College of Mechanical and Electrical Engineering, Wuhu 241002, China;2. Anhui Key Laboratory of High-performance Non-ferrous Metal Materials, Anhui Polytechnic University, Wuhu 241000, China;3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;4. Nano and Molecular Systems Research Unit, University of Oulu, P.O. Box 3000, FIN-90014 Oulu, Finland;1. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, 200050, China;2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China;3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;4. School of Material and Engineering, Shanghai University, Shanghai, 200444, China |
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| Abstract: | Taking advantages of reaction composite brazing, transient liquid phase bonding (TLP) and partial transient liquid phase bonding (PTLP), a novel process with the characteristics of low-temperature bonding and high-temperature resisting was developed for joining Cf/SiC composite to GH3044 alloy by using (Cu-Ti) + C + Ni mixed powder filler. Under the bonding temperature (980 °C), the reaction between the liquid Cu-Ti alloy and C particles (reaction composite mechanism), composition homogenizations between the joining layer and Ni particles (PTLP mechanism) as well as Ni-based substrate (TLP mechanism) occurred to complete the transformation (Cu,Ti)l + Cs + Nis → TiCs + (Cu,Ni)s. Thereby, a joint with high-temperature resistance and excellent mechanical properties was obtained in relatively short holding time. The melting-point of the joint (1050 °C) was obviously higher than that of Cu-Ti alloy (898 °C) in the filler. The bonded joints exhibited shear strengths of 229, 225 and 104 MPa at room temperature, 600 °C and 1000 °C, respectively. |
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| Keywords: | GH3044 alloy Reaction-composite diffusion brazing Low-temperature bonding High-temperature resistance |
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