Powder injection molding of complex-shaped aluminium nitride ceramic with high thermal conductivity |
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| Affiliation: | 1. Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China;2. Beijing Advanced Innovation Center of Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China;1. College of Engineering"Celso Daniel Engineer", University Center St. Andrew Foundation, Av. Príncipe de Gales, 821, Santo André SP 09060-650, Brazil;2. Polytechnic School of the University of São Paulo, Av. Prof. Mello Moraes, 2463, São Paulo SP 05508-900, Brazil;3. Center for Engineering, Modeling and Applied Social Sciences, Federal University of ABC, Av. dos Estados, 5001, Santo André SP 09210-580, Brazil;1. Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology, Icheon, 17303, Republic of Korea;2. Department of Materials Science and Engineering, Korea University, Seoul, 02841, Republic of Korea;3. Ceramics Division, WONIK QnC Corporation, Gumi, 39425, Republic of Korea;1. The Department of Electrical and Electronic engineering, Southern University of Science and Technology, Shenzhen 518055, China;2. School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, Guangdong, China;3. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;4. The Department of Electronics and Electrical Engineering, Southeast University, Nanjing 210096, China;5. College of Materials Science and Engineering, Changsha University of Science & Technology, Changsha 410114, China;1. University of Louisville, Louisville, KY 40292, USA;2. Global Tungsten and Powders Corporation, Towanda, PA 18848, USA;3. Kinetics, A Dynacast Company, Wilsonville, OR, USA |
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| Abstract: | Aluminum nitride (AlN) is a promising material for heat sinks and microelectronic applications because of the advantages of high theoretical thermal conductivity, high mechanical strength, good electrical insulation, low dielectric constant and low thermal expansion coefficient. However, the difficulties in shaping complex-shaped parts with a high thermal conductivity have retarded the wide applications of AlN ceramic. Herein, we design a new binder system containing resin components and adopt the powder injection molding technology to fabricate complex-shaped AlN parts. After the debinding process, the special binder system would produce residual carbon, which could react with Al2O3 and result in decreasing oxygen impurity and forming the yttrium-rich aluminates. The yttrium-rich aluminates can accelerate the densification of AlN ceramic and fasten the oxygen on the triangular grain boundary, leaving the clean grain boundary beneficial for high thermal conductivity. The as-prepared AlN parts with complex shape possess a high thermal conductivity of 248 W m−1 K−1. |
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| Keywords: | Aluminum nitride ceramic Powder injection molding Binder system Thermal conductivity |
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