| 多层片式电感器介质材料及其工艺的发展现状 |
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| 引用本文： | 罗凌虹,周和平,黄河激,王少洪. 多层片式电感器介质材料及其工艺的发展现状[J]. 无机材料学报, 2001, 16(6): 1032-1040 |
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| 作者姓名： | 罗凌虹 周和平 黄河激 王少洪 |
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| 作者单位： | 清华大学材料工程系新型陶瓷与精细工艺国家重点实验室 北京 100084 |
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| 基金项目： | 国家自然科学基金(9995523) |
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| 摘 要： | 综述了近年来国内外多层片式电感器介质材料及其工艺研究的发展现状和方向，介绍了不同的频率段，应选择不同的低烧材料作为器件的介质材料，特别针对有关用于高频ＭＬＣＩｓ的低介瓷的研究进行了详细的介绍．同时概括了多层片式电感器生产的特殊而典型工艺过程．
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| 关 键 词： | 多层片式电感（MLCIs） 低烧介质材料 多层片式工艺 |
| 文章编号： | 1000-324(2001)06-1032-09 |
| 收稿时间： | 2000-11-29 |
| 修稿时间： | 2000-11-29 |
Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors |
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| LUO Ling-Hong,ZHOU He-Ping,HUANG He-Ji,WANG Shao-Hong. Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors[J]. Journal of Inorganic Materials, 2001, 16(6): 1032-1040 |
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| Authors: | LUO Ling-Hong ZHOU He-Ping HUANG He-Ji WANG Shao-Hong |
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| Affiliation: | State Key Lab of New Ceramic and Fine Processing; Department of Materials Science and Engineering Tsinghua University Beijing 100084; China |
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| Abstract: | Recently overseas and domestic general situation and developing tendence about dielec- tric materials and the processings for MLCIs were reviewed. Different low-temperature sintering materials should be selected for MLCIs in different frequency ranges. The research on the low dielectric constants materials for high frequency MLCIs particularly was introduced. While the specially and typically producing processings of MLCIs were summarized. |
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| Keywords: | multilayer chip inductors low-temperature sintering dielectric materials multilayer chip processings |
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