圆柱滚子外圆研磨优化实验研究

为优化圆柱滚子外圆研磨，以正交试验研究工件偏角、工件位置及转速（包括上下抛光盘转速、偏心轮转速和外齿圈转速）对材料去除率、表面粗糙度和圆度的影响。结果表明:工件偏角对材料去除率的影响最显著，转速组合次之，工件位置最小；转速对表面粗糙度的影响最显著，工件偏角次之，工件位置最小；工件位置对圆度的影响最显著，转速组合次之，工件偏角最小。最佳条件为工件偏角0°、工件位置0.8，各转速值分别为-76、84、80和48 r/min。加工15 min后，圆柱滚子的材料去除率可达到0.541 μm/min；表面粗糙度由0.078 μm降至0.045 μm，比初始表面粗糙度降低42.3%；圆度由0.74 μm降至0.41 μm，比初始圆度降低44.6%。 

Experiment on optimization of lapping cylindrical roller

To optimize OD grinding cylindrical roller process, orthogonal experiment is designed on the influences of workpiece deflection angle, workpiece position and rotation speeds, namely rotation speed of both polishing disks, eccentric wheel and outer gear ring, on material removal rate, surface roughness and roundness. Results show that the angle has most significant effect on material removal rate, followed by rotation speeds and workpiece position. As with surface roughness, the sequence should be rotation speed, angle and position. Workpiece position influences the roundness most, then rotation speeds and angle. The best processing parameters are deflection angle 0°, workpiece position 0.8, and rotation spees of up & down polishing disks, eccentric wheel and outer gear ring are -76, 84, 80 and 48 r/min, respectively. After machining for 15 min, the material removal rate could reach 0.541 μm/min, with surface roughness from 0.078 to 0.045 μm, decreasing 42.3%, and roundness from 0.74 to 0.41 μm, decreasing 44.6%.