| MEMS压力传感器上柔性化凸点制备方法 |
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| 引用本文： | 谯锴,吴懿平,吴丰顺. MEMS压力传感器上柔性化凸点制备方法[J]. 电子元件与材料, 2004, 23(5): 19-22 |
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| 作者姓名： | 谯锴 吴懿平 吴丰顺 |
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| 作者单位： | 华中科技大学材料学院,湖北,武汉,430074 |
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| 基金项目： | “863”计划资助项目(2002AA404110) |
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| 摘 要： | 介绍了一种适用于MEMS压力传感器的低成本、柔性化凸点下金属层(Under Bump Metal,UBM)和凸点(Bump)的制备工艺。其中凸点下金属层分为Ni-P/Cu两层,使用化学镀的方法沉积在Al焊盘表面;凸点通过焊膏印刷回流预制于陶瓷基片上,再通过转移工艺移植到焊盘上。为了检验此套工艺制出的凸点结构是否具有足够的强度,对凸点进行了剪切破坏试验。结果表明,凸点与凸点下金属层、凸点下金属层与Al焊盘均结合牢固,破坏主要发生在焊料凸点内最薄弱的金属间化合物层(Intermetallic Compound,IMC)。
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| 关 键 词： | 化学镀制备凸点下金属层 凸点制备与转移 压力传感器 |
| 文章编号： | 1001-2028(2004)05-0019-04 |
A Flexible Process for Manufacturing Solder Bump on MEMS Pressure Sensor |
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| QIAO Kai,WU Yi-ping,WU Feng-shun School of Material Science,Huazhong University of Science and Technology,Wuhan ,China. A Flexible Process for Manufacturing Solder Bump on MEMS Pressure Sensor[J]. Electronic Components & Materials, 2004, 23(5): 19-22 |
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| Authors: | QIAO Kai WU Yi-ping WU Feng-shun School of Material Science Huazhong University of Science Technology Wuhan China |
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| Affiliation: | QIAO Kai,WU Yi-ping,WU Feng-shun School of Material Science,Huazhong University of Science and Technology,Wuhan 430074,China |
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| Abstract: | A flexible and cheap process for manufacturing Al/Ni/Cu/Sn-Ag-Cu solder bump on MEMS pressure sensor isdiscussed. Under bump metallurgy (UBM) layer, Ni/Cu, deposited on Al pad by electroless plating process; The Sn-Ag-Cusolder bump on UBM is fabricated by screen print process combine with bump placement process. Finally, the shearing testwas employed to verify the strength of sample. |
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| Keywords: | UBM prepaared by electroless plating process bump fabrication and placement pressure sensor |
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