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Synthesis of a novel lignin-based epoxy resin curing agent and study of cure kinetics,thermal, and mechanical properties |
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| Authors: | Bing Chen Qiang Zhang Mangeng Lu Huifa Meng Zhencai Qu Chang'an Xu Enxiang Jiao |
| Affiliation: | 1. Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, China;2. Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, China
University of the Chinese Academy of Sciences, Beijing, China;3. Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, China University of the Chinese Academy of Sciences, Beijing, China CAS Engineering Laboratory for Special Fine Chemicals, Guangzhou, China;4. Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, China University of the Chinese Academy of Sciences, Beijing, China CASH GCC (Nanxiong) Research Institute of New Materials Co., Ltd, Nanxiong, China;5. Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, China University of the Chinese Academy of Sciences, Beijing, China Guangdong Provincial Key Laboratory of Organic Polymer Materials for Electronics, Guangzhou, China |
| Abstract: | In this contribution, first of all, the methoxy groups of organic solvent lignin (OSL) was converted to phenolic hydroxyl groups through demethylation reaction for the purpose of fabricating demethylated organic solvent lignin (DOSL). In addition, the resulting DOSL was utilized as a renewable material to synthesize a novel esterified lignin (EDOSL) by reacting with isobutyryl chloride for curing of epoxy resin. Finally, commercial liquid diglycidyl ether of bisphenol A was cured by EDOSL in the presence of 4-dimethylaminopyridine (DMAP) used as a catalyst based on dual-curing mechanism. Dual curing is a processing methodology based upon the alliance of two diverse and compatible polymerization reactions occurring sequentially or simultaneously. According to the FTIR spectra and 1H-NMR analyses, the demethylation of OSL, esterification of DOSL, and the curing reaction of epoxy resin with EDOSL were successfully conducted. The value of the phenolic hydrogen in the DOSL was approximately 4.89 mmol/g, which increased by 12.64% after demethylation. The thermal and mechanical performances of these cured epoxy samples were measured by DSC, DMA, TGA, and tensile testing. The epoxy system cured by 10%wt esterified lignin with 1%wt DMAP possessed the tensile strength of 71.54 ± 7.50 MPa and the initial degradation temperature (T5%) of 370°C, which can compete fairly with commercial aromatic curing agents or other lignin-based agents studied currently for the curing of epoxy systems. |
| Keywords: | biomaterials differential scanning calorimetry mechanical properties thermal properties thermosets |