Tutorial: temperature as an input to microelectronics-reliabilitymodels |
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Authors: | Lall P |
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Affiliation: | Motorola Inc., Plantation, FL, USA; |
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Abstract: | This tutorial discusses various modeling methodologies for temperature acceleration of microelectronic-device failures; there are situations in which some methodologies give-misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of physics-based temperature modeling. There are alternatives to both the Arrhenius relation and the MilHdbk-217 approach to reliability. In Japan, Taiwan, Singapore, and Malaysia, a physics-of-failure approach is used by most companies. Philips in the Netherlands and the CADMP Alliance in the USA have developed methods and software to conduct physics-based reliability assessments |
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