| 多线切割机的切割运动分析 |
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| 引用本文： | 种宝春,靳永吉,罗嘉辉.多线切割机的切割运动分析[J].电子工业专用设备,2010,39(2):31-34. |
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| 作者姓名： | 种宝春 靳永吉 罗嘉辉 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,河北三河燕郊,065201 |
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| 摘 要： | 半导体晶圆不断向大直径方向发展,内圆刀具的单片切割方式已经不能满足大直径晶圆的切片要求,随着多线锯切割技术的完善,多线切割机已经是半导体材料切片的主流设备。对砂粒在切割过程中的运动进行了分析,同时对钢线张力、切削进给运动进行了理论分析。
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| 关 键 词： | 多线切割 研磨去除 变速进给 |
The Slicing Movement Analysis of Multi-wire saw |
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| CHONG baochun,JING yongji,LUO jiahui.The Slicing Movement Analysis of Multi-wire saw[J].Equipment for Electronic Products Marufacturing,2010,39(2):31-34. |
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| Authors: | CHONG baochun JING yongji LUO jiahui |
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| Affiliation: | The 45nd Research Institute;CECT;Hebeiyanjiao 065201;China |
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| Abstract: | The semiconductor crystal wafers develop towards bigger diameter. The inner-diameter slicing of single wafer can＇ t satisfy the incise demand of the wafers with bigger diameter, so the multi-wire saw has become the main equipment in the field of the semiconductor slicing technology. The movement of the sand grain in the slicing process is analyzed in this article. The tension force of the wire and the feeding movement of the slicing are also analyzed theoretically in the article. |
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| Keywords: | Multi-wire saw Abrasive removal Variable-speed feeding |
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