环氧树脂／碳化硅晶须导热复合材料的制备研究

用共混复合-浇注成型法制备环氧树脂／碳化硅晶须（EP／SiCw）导热复合材料，研究了导热填料种类、形状、用量和表面处理对复合材料的导热性能、力学性能和热性能的影响。结果表明，SiCw较SiCp更易改善材料的导热性能，热导率随SiCw用量的增加而增大，当SiCw体积分数为42．1％时，复合材料热导率为0．9611W／（m·K）；力学性能随SiCw用量的增加先增加后降低。表面处理有利于提高复合材料的导热性能和力学性能。SiCw的加入使环氧树脂的耐热性提高、Tg降低。

Preparation of EP/SiCw thermal conductive composites

The epoxy resin/silicon carbide whisker（EP/SiCw） thermal conductive composites were prepared by blending-casting moulding method.The composition parameters （species, shape,concentration and surface modification of filler） were discussed as main factors that affect the thermal conductive, mechanical and thermal properties of the composites.The results revealed that the SiCw was more favorable to improve the thermal conductivity ofthe composites,a much higher thermal conductivity of0.9611 W/ （m·K） can be achieved with 42.1% SiCw, about five times of that of native epoxy. The flexural strength and impact strength of the composites increased firstly, but decreased with excessive addition ofSiCw. Surface modification of SiCw with KH-560 exhibited a remarkable positive effect on thermal conductivity and mechanical properties of the composites. The heat resistance of composites increased and the glass transition temperature （Tg） decreased with addition of SiCw.