掩模电镀镍微结构均匀性的研究

在给定的电镀液组分下，对掩膜电镀微结构的厚度均匀性及镀层横截面轮廓进行了研究。讨论了影响微结构镀层厚度均匀性的主要因素。分析了镀层横截面轮廓随电流密度的改变而变化的原因。电镀液中无添加剂时，提出镀层均匀性与阴极极化度直接相关；电镀液中有添加剂时，本实验所使用添加剂所具有的并存吸附状态是影响镀层均匀性的主要因素。通过实验得到可获得良好均匀性镀层的电镀参数：i=6±2 mA/cm2，T=25°C。

Uniformity study of Ni Microstructure Deposited by Through-Mask Plating

This paper investigates the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures as a function of electroplating conditions. Factors which influence the thickness uniformity of microstructures were discussed. It was found that the thickness uniformity and the cross-sectional profiles of microstructures could be controlled by varying the process conditions. When no additives in electroplating solution, the polarizability were applied to explain the changes in the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures; with additive, coexisting adsorption states of additive in electroplating is believed to be responsible for the change in the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures. At last, a uniform thickness distribution and microstructures with flat profiles could be obtained at optimal plating conditions of 6±2mA/cm2 and 25°C.