| 基于MSP430和MAX1452的温度补偿系统设计 |
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| 引用本文： | 张浩,孟开元,曹庆年.基于MSP430和MAX1452的温度补偿系统设计[J].微计算机信息,2006,22(29):244-246. |
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| 作者姓名： | 张浩 孟开元 曹庆年 |
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| 作者单位： | 710065,陕西西安石油大学计算机学院 |
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| 摘 要： | 采用MSP430低功耗单片机和MAX1452智能芯片,设计一个温度补偿系统,对由于温度变化而引起的温度漂移误差进行补偿,达到设定的温度值。
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| 关 键 词： | 温度补偿 |
| 文章编号： | 1008-0570(2006)10-2-0244-03 |
| 修稿时间： | 2006年2月18日 |
Design of Temperature Compensation System with MSP430 and MAX1452 |
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| Zhang,Hao,Meng,Kaiyuan,Cao,Qingnian.Design of Temperature Compensation System with MSP430 and MAX1452[J].Control & Automation,2006,22(29):244-246. |
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| Authors: | Zhang Hao Meng Kaiyuan Cao Qingnian |
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| Abstract: | It is temperature offset system designed by the MSP430 which is a system-on-chip of low-power consumption and the MAX1452 which is an intelligent chip.It achieves the preset temperatures by compensating the temperature errors which result from the temperature varying. |
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| Keywords: | MSP430 MAX1452 |
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