| 内置无铅锡膏印刷机的检测算法研究 |
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| 引用本文： | 龙云,王文昌,邝泳聪,张宪民. 内置无铅锡膏印刷机的检测算法研究[J]. 机电工程技术, 2009, 38(5): 20-23 |
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| 作者姓名： | 龙云 王文昌 邝泳聪 张宪民 |
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| 作者单位： | 华南理工大学机械汽车工程学院,广东广州,510640;华南理工大学机械汽车工程学院,广东广州,510640;华南理工大学机械汽车工程学院,广东广州,510640;华南理工大学机械汽车工程学院,广东广州,510640 |
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| 基金项目： | 国家杰出青年科学基金，广东省科技攻关项目 |
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| 摘 要： | 针对PCB锡膏印刷中常见的偏移、桥接、少锡、多锡等缺陷，提出了一种可集成于锡膏印刷机的机器视觉锡膏检测算法。该算法通过对锡膏印刷特征的建模、锡膏的定位、区域特征的提取，实现了锡膏印刷缺陷的检测。实验结果表明，该算法能够有效地识别常见的印刷缺陷，并且速度上可满足在线检测要求。
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| 关 键 词： | 锡膏 机器视觉 区域特征 特征提取 |
Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing |
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| LONG Yun,WANG Wen-chang,KUANG Yong-Cong,ZHANG Xian-min. Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing[J]. Mechanical & Electrical Engineering Technology, 2009, 38(5): 20-23 |
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| Authors: | LONG Yun WANG Wen-chang KUANG Yong-Cong ZHANG Xian-min |
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| Affiliation: | School of Mechanical and Automotive Engineering;South China University of Technology;Guangzhou510640;China |
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| Abstract: | In order to inspect common PCB solder paste printing defects such as shift, bridge, lacking solder, surplus solder, an inspection algorithm based on machine vision that can be integrated in automatic vision screen printer is proposed. In this method, print feature modeling, solder paste positioning, region feature extracting are implemented to achieve solder paste printing defects detection. Experimental results show that the proposed method can effectively identify the above-mentioned printing defects, and... |
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| Keywords: | solder paste machine vision region feature feature extraction |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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