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A thermomechanical constitutive model for an epoxy based shape memory polymer and its parameter identifications |
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| Authors: | Kai Yu Amber J. W. McClung Gyaneshwar P. Tandon Jeffrey W. Baur H. Jerry Qi |
| Affiliation: | 1. Department of Mechanical Engineering, University of Colorado, Boulder, CO, 80309, USA 2. Air Force Research Laboratory, Materials and Manufacturing Directorate, WPAFB, Dayton, OH, 45433, USA 3. National Research Council Research Associate, AFRL, Wright-Patterson AFB, Dayton, OH, 45433, USA 4. University of Dayton Research Ins., Dayton, OH, USA |
| Abstract: | This paper presents a three-dimensional (3D) finite deformation thermomechanical model to study the glass transition and shape memory behaviors of an epoxy based shape memory polymer (SMP) (Veriflex E) and a systematic material parameter identification scheme from a set of experiments. The model was described by viscoelastic elements placed in parallel to represent different active relaxation mechanisms around glass transition temperature in the polymer. A set of standard material tests was proposed and conducted to identify the model parameter values, which consequently enable the model to reproduce the experimentally observed shape memory (SM) behaviors. The parameter identification procedure proposed in this paper can be used as an effective tool to assist the construction and application of such 3D multi-branch model for general SMP materials. |
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