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半导体晶圆制造车间层控制的内容及方法
引用本文:邵志芳,钱省三.半导体晶圆制造车间层控制的内容及方法[J].半导体技术,2003,28(9):48-51.
作者姓名:邵志芳  钱省三
作者单位:上海理工大学工业工程研究所微电子发展研究中心,上海,200093
摘    要:半导体晶圆制造企业是资本密集、技术密集型产业,晶圆制造厂也是公认生产最为复杂的工厂之一。产品更新换代快、市场竞争激烈等特点使得投资者对设备产能和设备利用率高度重视。这已不仅仅是技术问题,而是生产制造过程管理的问题。本文介绍了半导体晶圆制造车间层控制的内容及方法。

关 键 词:车间层控制  投料策略  实时调度
文章编号:1003-353X(2003)09-0048-04

Content and methods of shop-floor control in semiconductor wafer fabrication
SHAO Zhi-fang,QIAN Xing-san.Content and methods of shop-floor control in semiconductor wafer fabrication[J].Semiconductor Technology,2003,28(9):48-51.
Authors:SHAO Zhi-fang  QIAN Xing-san
Abstract:The semiconductor wafer fabrication is a business of high investment, high technologyand fierce competition. It involves perhaps the most complex manufacturing process ever used. Theoutput and equipment utilization usually were paid high attention by investors for the characteris-tics such as rapidly changing products and heavy market competition, and which is not only atechnology problem, but also a manufacturing management problem. Content and methods of shop-floor control in semiconductor wafer fabrication were introduced compendiously.
Keywords:shop-floor control  input regulation policies  real-time scheduling
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