| 电子产品中的无铅焊料及其应用与发展 |
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| 引用本文： | 苏佳佳,文建国.电子产品中的无铅焊料及其应用与发展[J].电子与封装,2007,7(8):5-8. |
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| 作者姓名： | 苏佳佳 文建国 |
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| 作者单位： | 广东工程职业技术学院,广州,510520;广东工业大学,广州,510006;广东工业大学,广州,510006 |
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| 摘 要： | 由于传统焊接技术使用的Sn-Pb焊料中的铅会对环境造成污染而被禁止使用,近年来无铅焊料成为了研究热点。文中介绍了运用于电子产品中的无铅焊料的发展背景、特点及要求。根据应用温度不同,无铅焊料可以分为低温、中温和高温无铅焊料。文章综述了它们各自的应用特点、场合及存在的问题和发展前景。
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| 关 键 词： | 无铅焊料 锡银合金 锡锌合金 锡铋合金 |
| 文章编号： | 1681-1070（2007）08-0005-04 |
| 修稿时间： | 2007-05-11 |
Application Feature and Development of Lead-Free Solders Used in Electronical Product |
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| SU Jia-jia,WEN Jian-guo.Application Feature and Development of Lead-Free Solders Used in Electronical Product[J].Electronics & Packaging,2007,7(8):5-8. |
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| Authors: | SU Jia-jia WEN Jian-guo |
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| Affiliation: | 1. Guangdong Polytechnic College, Guangzhou 510520, China; 2. Guangdong University of technology, Guangzhou 510006, China |
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| Abstract: | Due to the destroyed to environment, the solders of Sn-Pb which have been used in traditional welding technology are forbidden. And the lead-free solders have been extensively research in these years. In this paper, the developing-background, feature and requirement of lead-free solders which used in electronic product were introduced. According to the application temperature, the solders have three types, which are low- temperature, mid-temperature and high-temperature. And their application features, fields and existing problems were presented respectively. The development of lead-free solders was also described. |
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| Keywords: | lead-free solder Sn-Ag Sn-Zn Sn-Bi |
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