Simulations Based Design for a Large Displacement Electrostatically Actuated Microrelay |
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| Authors: | Gooi Boon Chong Kam See Hoon Ijaz H Jafri Daniel J Keating |
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| Affiliation: | (1) Nanyang Polytechnic School of Engineering, 80 Ang Mo Kio Ave 8, Singapore, 569830;(2) Corning Intellisense, 36 Jonspin Road, Wilmington, MA 01887, USA;(3) Corning Intellisense, 36 Jonspin Road, Wilmington, MA 01887, USA |
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| Abstract: | An electrostatically actuated microrelay with large displacement, small actuation voltage and limited plate surface dimensions is designed to meet stringent telecommunication switching requirements. Fabrication feasibility and performance characteristics of the device are evaluated using a commercial CAD for MEMS tool. Simulation results of the device performance including pull-in voltages for different suspension stiffness variations, natural frequencies, stresses and restoring forces are presented. |
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| Keywords: | microrelay microswitch electrostatic actuation MEMS CAD simulation |
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