| 热处理对96.5Sn3.5Ag焊点中Cu-Sn合金层的影响 |
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| 引用本文： | 汤清华,潘晓光,Lawrance C.M.Wu.热处理对96.5Sn3.5Ag焊点中Cu-Sn合金层的影响[J].电子工艺技术,1999,20(3):106-108. |
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| 作者姓名： | 汤清华 潘晓光 Lawrance C.M.Wu |
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| 作者单位： | 1. 华中理工大学电子科学与技术系,武汉,430074
2. 香港城市大学物理与材料科学系 |
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| 摘 要： | 在焊点与铜基之间形成的Ｃｕ－Ｓｎ合金成分对表面安装器件的疲劳寿命起着关键性的作用。本文着重研究了９３．５Ｓｎ３．５Ａｇ（简写为Ｓｎ－Ａｇ）焊料与Ｃｕ基界面间形成的合金层，通过电子扫描显微镜（ＳＥＭ），Ｘ衍射（ＸＤＡ）及能谱Ｘ射线（ＥＤＸ）等分析发现，在Ｓｎ－Ａｇ与Ｃｕ基界面上存在Ｃｕ６Ｓｎ５及Ｃｕ３Ｓｎ两种合金成分，且随着热处理时间增加，Ｃｕ６Ｓｎ５合金层增厚，并在该处容易出现裂纹而导致焊点强度减弱，从而使焊点产生疲劳失效。
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| 关 键 词： | 热处理 96.5Sn3.5Ag焊点 合金层 |
| 修稿时间： | 1999-01-04 |
Effect of Annealing on Intermetallic Cu-Sn of 96.5Sn3.5Ag Solder Joint |
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| Tang Qinghua,Pan Xiaoguang,Lawrance C.M.Wu.Effect of Annealing on Intermetallic Cu-Sn of 96.5Sn3.5Ag Solder Joint[J].Electronics Process Technology,1999,20(3):106-108. |
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| Authors: | Tang Qinghua Pan Xiaoguang Lawrance CMWu |
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| Affiliation: | Tang Qinghua Pan Xiaoguang (Dept of Electronics of Science and Technology Huazhong University of Science and Technology) Lawrance C.M.Wu (Dept of Physics and Materials Science of City University of Hongkong) |
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| Abstract: | Copper-Tin(Cu-Sn) Intermetallic compounds(IMC) between solder joint and Cu pad plays a key role on the fatigue life serface on mount technology(SMT).In this paper,the Cu-Sn IMC of 96.5Sn3.5Ag solder joint was studied.Through SEM,XDA and EDX analysis,it was found that there were two kinds intermetalic,Cu 6Sn 5 and Cu 3Sn,on the interface of solder and copper,The thickness of intermetallic increased with annealing time increased.It would cause the creak of the solder and abate the mechanical strength of solder and make solder fatigue failure. |
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| Keywords: | Annealing 96 5Sn3 5Ag solder joint Intermetallic |
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