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Pulsed electrodeposition of bismuth telluride films: Influence of pulse parameters over nucleation and morphology
Authors:V Richoux  C Boulanger  JM Lecuire
Affiliation:Laboratoire d’Electrochimie des Matériaux-UMR 7555, Université Paul Verlaine-Metz, 1 Bd Arago, Technopôle, CP 87811, F-57078 Metz Cedex 3, France
Abstract:Pulsed electrodeposition methods were applied to the preparation of bismuth telluride films. Over the potential ranges from −170 mV to −600 mV, the formation of Bi2Te3 nuclei proceeded through a three-dimensional instantaneous nucleation mode. The nuclei densities for several values of potential were ranged between ∼106 nuclei cm−2 and ∼108 nuclei cm−2. For a pulsed galvanostatic electroplating, the best covering percentage and a stoichiometry close to the desired Bi2Te3 were obtained with the parameters ton, toff and Jc, respectively, equal to 10 ms, 1000 ms and −100 mA cm−2.
Keywords:Bismuth telluride  Electrodeposition  Pulse plating  Nucleation  Morphology
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