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DESIGN AND PREPARATION OF SILICON NITRIDE COMPOSITE WITH HIGH FRACTURE TOUGHNESS AND NACRE STRUCTURE
作者姓名:Y Huang  H.N Hao  Y.L. Chen and B.L.Zhou
作者单位:1)Department of Materials Science and Engineering,Tsinghua University,Beijing 100084,China 2)Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110015,China )
摘    要:DESIGNANDPREPARATIONOFSILICONNITRIDECOMPOSITEWITHHIGHFRACTURETOUGHNESSANDNACRESTRUCTUREYHuang;H.NHao;Y.L.ChenandB.L.Zhou(1)De...

收稿时间:1996-12-25
修稿时间:1996-12-25

DESIGN AND PREPARATION OF SILICON NITRIDE COMPOSITE WITH HIGH FRACTURE TOUGHNESS AND NACRE STRUCTURE
Y Huang,H.N Hao,Y.L. Chen and B.L.Zhou.DESIGN AND PREPARATION OF SILICON NITRIDE COMPOSITE WITH HIGH FRACTURE TOUGHNESS AND NACRE STRUCTURE[J].Acta Metallurgica Sinica(English Letters),1996,9(6):479-484.
Authors:Y Huang  HN Hao  YL Chen and BLZhou
Abstract:A new way of designing and preparing silicon nitride ceramic composite with high fracture toughness and nacre structure has been proposed. To mimic the laminated structure of nacre, Si_3N_4 matrix ceramic layer can be obtained through compacting rolling method. To mimic the secondary toughening of nacre structure, SiC whisker is added into Si_3N_4 and acts as the secondary toughening phase. Boron nitride (BN)is selected to mimic the organic layer in nacre so as to form the weak interfaces between Si_3N_4 layers. Alumina is added into BN to adjust the bonding strength of the interface.The Si_3N_4 sheets are stacked into the die after coating with BN. After the removal of the organic matter in them, the green body is hot pressed at 1820℃for 1.5 hours under N_2 atmosphere. The fracture toughness of the so-made Si_3N_4 composite at room temperature is 20.36MPa m~(1/2), the three-point bending strength at room temperature is 651.47MPa. The crack spreads and deflects along the interface between BN and Si_3N_4 layer and extends through the BN layer into Si_3N_4 layer. The improvement of the fracture toughness may be due to the staircase-shape-like crack which provides the long crack path, the fracture and deformation of Si_3N_4 layer, and the pullout of SiC whiskers from the Si_3N_4 layer.
Keywords:secondary toughening  compact rolling  silicon nitride  nacre Structure
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