| 新型耐高温PI胶粘剂用单体的合成及表征 |
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| 引用本文： | 宋育杰,陈功.新型耐高温PI胶粘剂用单体的合成及表征[J].中国胶粘剂,2013(2):13-17. |
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| 作者姓名： | 宋育杰 陈功 |
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| 作者单位： | 北京航空航天大学材料科学与工程学院 |
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| 摘 要： | 为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400～500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500～1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。
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| 关 键 词： | 碳硼烷 耐高温 聚酰亚胺 胶粘剂 |
Synthesis and characterization of monomer for new type polyimide adhesive with high temperature-resistance |
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| Song Yujie,Chen Gong.Synthesis and characterization of monomer for new type polyimide adhesive with high temperature-resistance[J].China Adhesives,2013(2):13-17. |
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| Authors: | Song Yujie Chen Gong |
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| Affiliation: | (School of Materials Science and Engineering,Beijing University of Aeronautics and Astronautics, Beijing 100191,China) |
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| Abstract: | In order to improve the heat-resistance of polyimide(PI) adhesive,a new type PI monomer with carborane was first synthesized by the carborane introduced into PI molecular chain,and its structure was characterized by infrared spectroscopy(FT-IR).The results showed that the PI monomer with carborane could be cured by crosslinking in heating process of 400-500 ℃.When it was used as a matrix of PI adhesive,the PI adhesive had excellent thermal stability(slightly change in hot weight-loss at 500-1 300 ℃).Thereby,a new route and new method for preparing adhesives with high temperature-resistance were offered. |
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| Keywords: | carborane high temperature-resistance polyimide(PI) adhesive |
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