基于LTCC 厚薄膜混合基板的Ka 波段T/ R 组件封装技术

收发组件的集成封装技术是毫米波二维有源相控阵领域应用研究的重点和难点。文中采用基于低温共烧陶瓷厚薄膜混合基板制造工艺技术,同时结合先进的微组装工艺,实现了Ka 波段八单元组件的高精度、高密度及气密封装;给出了收发组件的封装模型,通过仿真与实测对比着重分析了垂直互联、功率分配/ 合成网路及通道隔离的提升等关键技术,并测试了无源组件的微波性能。结果表明:该集成封装技术能够满足二维毫米波相控阵天线对T/ R 组件小型轻量化和高组装密度的技术要求。

Packaging Technology for Ka-band T / R Modules Based on LTCC Thick-thin Film Hybrid Substrate

The package technology for T/ R modules is one of the most important and difficult research directions for the engineering applications of millimeter-wave two-dimensional phased array antenna. The integration and packaging of Ka-band eight-element T/R module is presented. The module is based on thin-film low temperature co-fired ceramic multilayer substrate and hybrid microwave integration technologies with high-precision, high-density and gas-tight characteristics. The package model is provided, and then vertical translation, high-performance power combiner/ divider and channel-isolation improvement are analyzed based on the comparison of simulation and experiment. Passive module is developed and its microwave performance is tested to demonstrate the packaging technologies. The results exhibit excellent characteristics and can meet wideband and wide-angle scanning requirements of radar system.